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ST’s recovery has an AI component

Power conversion and optical connections explain how the chipmaker participates in the expansion of AI infrastructure.

STMicroelectronics reported $3.757 billion in third-quarter revenue on 29 October, up 17.9% from a year earlier. Its RF Optical Communications segment grew faster, rising 46.2% to $504 million. These are company and product-segment figures; the release does not provide a separate AI revenue total.[1]

Chief executive Jean-Marc Chery identified AI data centres and low-Earth-orbit satellite communications as growth drivers alongside a broader market recovery. The quarter ended on 26 September.[1]

ST’s role becomes clearer by following what an AI server needs around its processor. Its PIC100 silicon-photonics platform makes optical links for moving data within and between data centres. In June, ST described the platform as already in high-volume production for leading hyperscalers.[2]

Electricity follows another chain. ST supplies power semiconductors and converters that step down high-voltage distribution towards the low voltages chips use. Its work with NVIDIA includes architectures that take an 800-volt DC supply through intermediate levels such as 50, 12 or 6 volts. Higher voltage means less current for the same power, easing the burden on cables before conversion near the chips.[2]

Control chips connect the two businesses: inside optical modules, ST’s microcontrollers configure lasers and detectors and monitor temperature and voltage. The commercial opportunity extends to moving power and data reliably around each accelerator.[2]

For the fourth quarter, ST forecasts $4.15 billion in revenue and a 39% gross margin at the midpoints of its guidance. That revenue forecast implies 10.5% growth from the September quarter.[1]

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Sources & further reading

  1. STMicroelectronics Reports Q3 2026 Financial Results STMicroelectronics / GlobeNewswire · 29 Oct 2026 · Accessed 29 Oct 2026
  2. STMicroelectronics and the infrastructure of Cloud AI STMicroelectronics · 26 Jun 2026 · Accessed 29 Oct 2026